MCIGroup of Companies

Senior Associate Engineer (Semiconductor Machine Equipment)

Engineering·Permanent·Islandwide·$3,000–4,200 /mo

Applications for this role are made on MyCareersFuture, the government job portal. MCI advertises the role there under its employment agency licence. The service is free for job seekers.

Position level
Non-executive
Experience
1 year minimum
Vacancies
5
Posted
31 Oct 2026 (5 days ago)
Applications close
30 Nov 2026 (25 days left)

About this role

Job Highlights

  • Located at Serangoon North, Singapore
  • Up to S$4,200
  • Working Days: 5 or 6 days per week (based on shift arrangement)
  • Benefits: AWS, Performance Bonus & Shift Allowances

Working Hours

Initial Training Period (Approximately 1–3 Months)

  • Normal Shift: 8:30 AM – 5:30 PM

After Training (Based on Operational Requirements)

  • Shift 2: 2:45 PM – 11:15 PM
  • Shift 3: 10:45 PM – 7:15 AM

Shift allowances are provided according to the assigned shift.

Responsibilities

  • Perform machine calibration, setup, testing and performance validation on semiconductor packaging equipment to ensure compliance with manufacturing specifications and quality standards.
  • Diagnose and troubleshoot assembly and manufacturing process issues, implementing corrective actions to improve first-pass yield, equipment performance and production cycle time.
  • Support Process Engineers in developing and qualifying inspection protocols, process recipes, tooling and manufacturing processes, including updating work instructions and procedures.
  • Verify the availability of manufacturing fixtures, jigs and technical documentation while ensuring accurate test data recording, quality reporting and continuous process improvement.

Skills/Experience Required

  • Diploma or Degree in Materials Science, Electrical, Mechanical Engineering or a related engineering discipline.
  • At least 3 years of relevant experience in semiconductor manufacturing, equipment engineering, process engineering or a related technical environment.
  • Strong analytical and systematic problem-solving skills, with knowledge of statistical analysis, Design of Experiments (DOE), JMP or Minitab being advantageous.
  • Experience with semiconductor equipment interfaces, machine calibration, process development or advanced packaging technologies such as Die Attach, Thermocompression Bonding (TCB), Fan-Out Wafer Level (FOWL) or Flip Chip (FC) is an advantage.
  • Proficiency in Microsoft Excel and technical data analysis, with the ability to work during normal training hours and subsequently on assigned afternoon or night shifts.

Skills

  • Update Procedures
  • Lean Manufacturing
  • Recipe Development
  • test documentation
  • Continuous Process Improvement
  • Manufacturing Processes
  • Industrial Engineering
  • System Setup
  • Advanced Engineering
  • Firmware
  • Packaging Testing
  • Inspection Engineering Management
  • Taking Corrective Action
  • Layout
  • Electronics
  • Calibration

What happens after you apply

  1. 1

    Register

    Submit your details and CV, or apply for a live role. Registration takes a few minutes and is free of charge.

  2. 2

    Meet your consultant

    A consultant who specialises in your field contacts you to discuss your requirements, including pay, location, working hours and career direction.

  3. 3

    Get matched

    The consultant puts you forward only for roles that suit your experience and goals, and prepares you for each interview.

Apply on MyCareersFuture

Alternatively, you can register your details, and a consultant who specialises in your field will contact you as suitable roles open.