SENIOR ASSOCIATE ENGINEER, EQUIPMENT PRODUCTION - PERMANENT

Associate/Senior Engineer | Equipment (Semicon) – 6 openings Basic Up to $4,800

Our client is a global leader in the design and manufacture of semiconductor assembly equipment, offering strategic acquisitions, adding die bonding, wedge bonding and a broader range of expendable tools to its core ball bonding packaging solutions of assembling semiconductor devices.

We are seeking highly committed and motivated individuals to join us.

1st week work 5 days, next week work 6 days, then 5 days then 6 days.

Shift 2: 2.45pm– 11:15pm ($15 /Shift)

Shift 3:10:45pm – 7:15am ($25 /Shift)

Job Description

• To perform machine performance validation on semiconductor packaging equipment through machine calibration, setup and testing based on defined work procedures.
• To provide level 1support to identify, diagnose and resolve assembly process related problems to achieve defined first pass yield and manufacturing cycle-time.
• To support Process Engineer to develop and qualify manufacturing inspection protocols (metrology equipment qualification or integrity test definition) to ascertain machine performance and integrity.
• To support Process Engineer in development and enhancement of process recipes, process tooling or manufacturing processes; inclusive of updating and enhancing of work procedures.
• To ensure and validate all necessary fixtures, jigs, drawings, and work instruction are available for manufacturing processes.
• To ensure timely input of manufacturing test data and support report output on machine quality.
• Perform other duties as assigned.

Qualifications

• Diploma/ degree in automation or electronic qualification, or relevant discipline.
• 2 to 5 years experience in semiconductor industry with equipment maintenance or testing engineering in a manufacturing facility, preferably in Electrical Wafer Sorting(EWS), Final Testing and Burn in testing of back-end operations.
• Possess strong interest in statistical analysis skill set with demonstrated ability to conduct design-of-experiment. Proficient in JMP or Minitab would be a plus
• Excellent systematic problem solving in areas of containment and counter-measures
• Experience in handling semiconductor capital equipment GUI and hands-on experience in process development of advanced packaging processes (die attach, TCB, FOWL or FC) will be advantageous
• Demonstrate flair in handling data analyzer, data processing tool (excel etc.) and words processing tools will be advantageous
• Ability to work on shift timing (2nd and 3rd).

Please make sure the below "Reason for leaving" is updated on your CV (Doc Words) before submitting to Lynn_Lim(a)mci.com.sg

Please Highlight yellow for related skills in your CV if you can.